发明名称 Thermocuring resin composition
摘要 The resin composition comprises (a) at least one maleimide from the group consisting of bismaleimides of the formula I <IMAGE> or from the group consisting of polymaleimides of the formula II <IMAGE> and (b) at least one substance from the group consisting of compounds of the formula III <IMAGE> the linear dimers of compounds of the formula III and polymers of compounds of the formula III. The symbols R1 to R12, X, Y, Z, n, m1, m2 and m3 are as defined in Claim 1.
申请公布号 CH650008(A5) 申请公布日期 1985.06.28
申请号 CH19790007050 申请日期 1979.07.31
申请人 MITSUI TOATSU CHEMICALS, INCORPORATED 发明人 YAMAZAKI, NOBORU;TAKASE, TSUTOMU
分类号 C08F222/40;(IPC1-7):C08F222/40;C08F212/00;C08L25/18;C08L61/32 主分类号 C08F222/40
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