| 摘要 |
PURPOSE:To prevent the reliability of a semiconductor device from decreasing due to static electricity by coating a metallized layer on the surface of a ceramic cap in the state electrically connected with a ground terminal. CONSTITUTION:A pellet 6 is mounted with gold-silicon alloy 7 at the center of a cavity 5 of a package substrate 4 buried with metallized layers 3 formed continuously at bothends with external terminal 1 and internal leads 2, the bonding pad 8 of the pellet 6 and the leads 2 are then bonded by wirings 9 to be electrically connected, and hermetically sealed by a ceramic cap 11 with low melting point glass 10 as a bonding material. A semiconductor device is formed by mounting a cap 11 made of ceramic material of slightly smaller square shape than the substrate 4 and having a projection 12 of the shape projected to the position that coincides with the side of the substrate at the center of one side, on the package substrate 3 of planely square shape, and a metallized layer 13 coated by printing with tungsten on the surface of the cap is electrically conducted with the terminal 1 of a ground terminal with metal 14 such as solder. |
