| 摘要 |
PURPOSE:To directly apply the output of a substrate bias circuit without adding special steps by printing the output voltage of the bias circuit through bonding wirings on a thin metal plate on which a semiconductor substrate is secured. CONSTITUTION:A semiconductor device has a semiconductor substrate 11, bonding wirings 12, bonding wirings 13 for connecting to a thin metal plate 7 secured with the output electrodes of an internal substrate bias circuit and the substrate, a lead frame 14, a lead frame 15 connected with the thin plate, a ceramic package 16, a thin metal plate for securing the substrate, and a ceramic or metal thin plate 18. The output voltage of the bias circuit is connected through the wirings 13 with the frame 15, and connected with the plate 17 by a connecting wiring film 19 in the case. Since the back surface of the substrate is normally connected electrically ohmically with the thin metal plate, the output voltage is applied directly to the substrate without intermediary of a junction. |
