| 摘要 |
PURPOSE:To fix a resin case and a copper base on a specified position precisely by a method wherein opposing recession and projection are provided on a junction of a copper base and a resin case. CONSTITUTION:A ceramic substrate 3 is mounted on a copper base 18 through the intermediary of a solder 2 while a solder 4, each terminals 5, 7, 11 and a semiconductor chip 9 etc. are further laminated on the substrate 3 to solder the gaps between each parts. Then after coating the periphery of a recession 20 coming into contact with a projection 19 of a base 18 of a resin case 21 with an adhesive 14, the case 21 is pressure-fixed on the base 18 to inject the case 21 with Si gel 15 and epoxy resin 16. Through these procedures, the base 18 and the case 21 may be located to improve the workability as well as dimensional precision while eliminating the gap between the base 18 and the case 21 and avoiding leakage of gel 5. |
