| 摘要 |
PURPOSE:To enable to uniformly cool the built-in appliances of a semiconductor device, by a method wherein the air coolers are arranged in the lower direction of the semiconductor power convertor, the enclosed board is provided with a common base stand and the common base stand is utilized as a part of the cooling air circulating passage. CONSTITUTION:An enclosed board 6 has a common base stand 12 provided with a cavity 11 and the cavity 11 interconnects with the interior of the enclosed board 6 through ventilating holes 12A and constitutes a part of the cooling air circulating passage. The air coolers 5 are installed on the common base stand 12 in parallel left and right to transformers 1 for converter and in parallel up and down to a semiconductor rectifier 2 and respectively have a configuration provided extendedly to the longitudinal direction of the transformers 1 and the rectifier 2. Air cooled by the coolers 5 rises, and after cooling the rectifier 2, the air exceeds a wind guide plate 13, heads for the side of the transformer 1, flows down while cooling the transformer 1, enters the interior of the cavity 11, returns to the coolers 5 from the interior of the cavity 11 and circulates through the interior of the enclosed board 6 as indicated by arrows. According to this method, even though the coolers 5 are not made the capacities larger, the built-in appliances of the enclosed board 6 can be equally cooled. |
