| 摘要 |
The process for coating substrates with metals in a reaction chamber by depositing the metals from the gas phase comprises the following process steps: a) bonding the metals to be deposited as nuclei in one or more organometallic sandwich compounds, b) reduction of the pressure in the reaction chamber and simultaneous introduction of the sublimed organometallic compound (s) on its own or together with one or more other gaseous substances into the reaction chamber, c) liberation of the metal ions present as nuclei in the organometallic sandwich compounds by allowing the sandwich compounds to interact with an electromagnetic or corpuscular radiation in the reaction chamber, d) production of a polarising electrical or magnetic field in the reaction chamber, as a result of which the liberated metal atoms are deposited on the substrate (s) to be coated.
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