| 摘要 |
PURPOSE:To make it possible to provide a secondary orientation flat without mistaking the top and rear, by changing the direction of the orientation flat from the direction of a slicer blade, and making the saw mark different in the top and rear. CONSTITUTION:A supporting rod 2 is bonded to a face other than an orientation flat 4 (hereinafter referred to as OF) of a single crystal of a compound semiconductor of Groups III-V in which the main OF 4 is grounded or a face other than the opposite face of the OF 4, and a rotating inner peripheral slicer blade 3 is moved from the opposite side to the supporting rod 2 to slice the ingot 1 and give a wafer 5. Thus, in case the wafer 5 is placed with the OF 4 facing up, saw marks 6 are protruding to the right on the surface, and protruding to the left on the rear. The top and the rear can be easily distinguished to form the secondary orientation flat without any mistake. |
