| 摘要 |
<p>A process for the encapsulation of an electrical component (1) provided with at least one movable member (5), such as an overheating protection device, arranged externally of the component. The process comprises the steps of coating the component with a wax like material (2) in a molten state and in a sufficient amount to cover said at least one movable member (5), allowing said wax like material to solidify, incapsulating the wax coated component in an encapsulating material (3) having a solidifying temperature which is lower than the melting point of the wax like material and solidifying the encapsulating material.</p> |
