| 摘要 |
PURPOSE:To impart various polymers with high electrical conductivity having high stability with time, easily, in an industrial scale, by introducing nitrile groups to the surface of a polymer by a low-temperature plasma polymerization, and introducing copper sulfide into the polymer. CONSTITUTION:The surface of a polymer is treated preferably with oxygen plasma or nitrogen plasma, and nitrile groups are introduced into the surface part of the polymer in the form of a polymerized layer having a thickness of preferably 100Angstrom -1mum by a low-temperature plasma polymerization process. The obtained polymer is treated in a bath containing (A) Cu<2+> (e.g. CuSO4, CuCl2, etc.), (B) a reducing agent capable of reducing Cu<2+> to Cu<+> (e.g. FeSO4, glucose, etc.) and (C) a compound capable of releasing S and/or S ion (e.g. SO2, H2SO3, Rongalite C, etc.) to obtain the objective electrically conductive material. EFFECT:Electrical conductivity can be imparted even to a polymer free of nitrile group without deteriorating various physical properties of the original polymer.
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