| 摘要 |
PURPOSE:To obtain a composition of high storage stability and electrical conductivity, developing no rust on the surface of cured products, by incorporating a formulation containing copper powder as conductive material with alpha-ketol, aliphatic or aromatic thiol and/or thiodiarylamine. CONSTITUTION:The objective composition can be obtained by incorporating a formulation made up of (A) 50-98 (pref. 70-93) wt%, based on the final composition, of copper powder (e.g. reduced one, electrolytically deposited one, with a size <=300mum pref. 1-100mum) and (B) resin binder (curing matter having function as binder; e.g. styrene resin) with, as additive(s) (C) 0.001-0.3 (pref. 0.005-0.1) pt.wt. per pt.wt. of the copper powder, of at least one sort of compound selected from alpha-ketols (e.g. acetol, benzoin), aliphatic thiols (e.g. n-propyl mercaptan), aromatic thiols (e.g. thiophenol) and thiodiarylamines (e.g. thiodiphenylamine).
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