| 摘要 |
PURPOSE:To substantially improve productivity by a method wherein a post-baking is performed at the temperature at which a photoresist film will not be completely hardened, thereby enabling to form the cross-sectional shape of the profile part of the lower layer aluminum pattern in gentle-sloped inclination by performing an etching for a short period. CONSTITUTION:A negative type photoresist film is coated on the aluminum film whereon an aluminum pattern to be used for a relatively thick bonding pad will be formed, an exposing and developing process is performed, and a post baking process to be performed prior to an etching is performed at the temperature necessary for hardening of the photoresist film or below that temperature, or a lower layer aluminum pattern 1a and an upper layer aluminum pattern 3a are formed without performing the post baking process. As a result, the cross-sectional shape of the profile part of the lower layer aluminum pattern 1a is formed in gentle-sloped inclination, and no disconnection in stepping part is generated on the upper aluminum pattern 3a to be used for wiring. |
