| 摘要 |
PURPOSE:To obtain a frame, which does not use an expensive gold plated layer or a silver plated layer, and has sufficient soldering and bonding properties, by forming an electroless plated layer of a nickel and boron alloy on the surface. CONSTITUTION:An electroless plated layer of a nickel boron alloy is formed on the surface of a frame. The electroless plated layer of the nickel and boron layer can be formed on the entire surface of the lead frame, or the layer can be selectively formed only on a part, where excellent bonding property is required. For example, a ribbon shaped plate material comprising alloy 194 (Fe/Cu alloy) is blanked, and the shape as shown in the Figure is formed. Then, the electroless plating of the nickel and boron alloy is selectively applied to the hatched part, and the lead frame for a semiconductor device is obtained. |
