发明名称 Heat resistant resin composition
摘要 A heat resistant resin composition comprising from 10 to 90% by weight of a copolymer A and from 90 to 10% by weight of a copolymer B, in which the copolymer A is composed of an N-aromatic maleimide monomer residue, a maleimide monomer residue, a vinyl aromatic monomer residue and, optionally other vinyl monomer residue, the total content of the N-aromatic maleimide monomer residue and the maleimide monomer residue being from 10 to 45%, the content of the N-aromatic maleimide monomer residue being greater than the content of the maleimide monomer residue, the content of the vinyl aromatic monomer residue being from 90 to 55% and the content of said other vinyl monomer residue being from 0 to 20%, and the copolymer B is composed of a vinyl cyanide monomer residue, a vinyl aromatic monomer residue and, optionally other vinyl monomer residue, the content of the vinyl cyanide monomer residue being from 20 to 55%, the content of the vinyl aromatic monomer residue being from 80 to 45% and the content of said other vinyl monomer residue being from 0 to 20%.
申请公布号 US4525536(A) 申请公布日期 1985.06.25
申请号 US19830501111 申请日期 1983.06.06
申请人 MITSUBISHI MONSANTO CHEMICAL COMPANY 发明人 IKUMA, SADAO;AOKI, YUJI;WATANABE, NOBORU
分类号 C08L33/00;C08F2/02;C08F2/18;C08L25/00;C08L25/02;C08L25/12;C08L33/02;C08L33/18;C08L33/24;C08L35/06;(IPC1-7):C08L25/12 主分类号 C08L33/00
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