发明名称 ELECTROFORMING DIE AND ITS MANUFACTURE
摘要 PURPOSE:To obtain an electroforming die having a complex uneven part in a short period by electrodepositing a thin layer on the surface of a matrix having an uneven part, filling a filler contg. a mixture of epoxy resin with metallic powder as the base into the recesses, and forming an electrodeposited layer on the surface of the filler. CONSTITUTION:An electrodeposited thin layer 4 of about 0.2-1mm thickness is formed on the surface of a matrix 1 for an electroforming die such as a toothed matrix having plural projections 2 and recesses 3 on the surface. A filler 5 is filled into the recesses 3 with the layer 4 in-between to make the surface of the matrix 1 nearly even. A mixture of epoxy resin with 5-50wt% powder of a metal such as Ni is used as the base of the filler 5. The filler 5 is then cured, and at this time, the surface of the filler is activated with PdCl2 or the like. A plated layer 6 of about 0.01-0.1mm thickness is formed on the activated surface and an electrodeposited layer 7 is formed on the layer 6 in a plating bath through which a high electric current can be passed, such as a nickel sulfamate bath.
申请公布号 JPS61199093(A) 申请公布日期 1986.09.03
申请号 JP19850039831 申请日期 1985.02.28
申请人 YAMATAKE HONEYWELL CO LTD 发明人 AIHARA KEIJI;UCHIDA HIROTOSHI
分类号 C25D1/00;C25D1/10 主分类号 C25D1/00
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