| 摘要 |
PURPOSE:To contrive the improvement of soldering properties and metal bonding properties of lead terminals in various electronic parts by performing wire bonding after removing the surface layer of a base where added elements of the base are thickened by grinding or etching. CONSTITUTION:The surface layer of a base consisting of Cu-radical alloy added with at least one component of Si, Fe, Ni, Sn, P, Mn, Al, Y and Be where the added elements are thickened is removed so as to reduce the concentration of the added elements on the base surface at bonding of wires including Au or Al. The removal of base surface layer by grinding or etching is performed in a manner a mechanical strength of the electron parts is not damaged. Also, when the removal of surface layer is performed by mechanical grinding, this grinding treatment generates a dislocation net on the base surface thereby promoting the proceeding of mutual diffusion at bonding of an Au wire and enabling the increase of the bonding strength. |
