| 摘要 |
PURPOSE:To shorten a bonding wire, to reduce the inductance of a power supply system and to improve the AC characteristics of a LSI by extending and forming a pattern for a power supply up to the inside from a pattern for a signal. CONSTITUTION:Patterns 31', 32'... for a power supply are extended and formed up to the internal end of a peripheral section 5. Accordingly, the length of bonding wires 7' connecting the patterns 31', 32'... for the power supply and bonding pads 6 for a LSI chip 2 is shortened, the inductance of a power supply system is reduced, and the AC characteristics of a LSI are improved. |
