发明名称 FORMATION OF THIN METALLIC DESIGN
摘要 PURPOSE:To form safely a metallic design by depositing the specific thin metallic film on various kinds of substrates, forming a design pattern thereon by alkali soluble ink and etching the thin metallic film then dissolving and removing the ink. CONSTITUTION:A thin film 2 consisting of In-Sn oxide or metal such as Au, Al, Ni, Cu, Co, Cr or the like is deposited by a method such as vacuum deposition, electroless plating, sputtering or the like on a base plate 1 which is an org. film, plastic plate, glass plate, etc. The part to be formed as a design pattern thereon is covered by alkali soluble ink 3. A thin metallic film 2 in the exposed part is dissolved and removed by an acid such as HCl, FeCl3 or the like and the substrate is dipped in an alkaline soln. such as NaOH or the like to dissolve and remove the ink 3 forming the design pattern. The operation is carried out safely in excellent working environment as an org. solvent such as trichloroethylene or the like is not used, unlike in conventional manner.
申请公布号 JPS60116790(A) 申请公布日期 1985.06.24
申请号 JP19830225262 申请日期 1983.11.28
申请人 NITSUKOU PROCESS:KK;NAKAMURA TAKASHI 发明人 NAKAMURA TAKASHI
分类号 C23F1/00;C23F1/02 主分类号 C23F1/00
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