发明名称 PROCESS FOR FORMING PATTERN
摘要 PURPOSE:To give high sensitivity and high resolving power to a resist material and to improve its plasma resistance by coating using a polymer contg. specified polymn. unit as a resist material, exposing selectively to electron beam, and developing with a polar solvent. CONSTITUTION:A polymer contg. polymn. unit expressed by the formula (wherein R is C, H, O, halogen, 4-15C alkyl, or a group bonding to COOH with a tert. C atom; X is an electron attracting group such as hologen. lower alkyl, NO2, CN, etc.; C...C means that two C atoms are directly or indirectly bonded) is coated as a resist meaterial, and is exposed selectively by electron beam, and is developed with a polar solvent. By this process, the ester bond is split to form an acid in the primary chain and the polarity is increased. Thus, only the exposed part becomes soluble in the solvent. At the same time, a posi-type resist pattern having high sensitivity and high resolving power is obtd. by the synergistic effect due to decrease of the mol.wt. caused by the decomposition of the primary chain of the polymer.
申请公布号 JPS60115931(A) 申请公布日期 1985.06.22
申请号 JP19830222192 申请日期 1983.11.28
申请人 FUJITSU KK 发明人 AKIMOTO SEIJI
分类号 G03F7/20;G03C1/72;G03C5/08;G03F7/004;G03F7/039;H01L21/027 主分类号 G03F7/20
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