| 摘要 |
PURPOSE:To enhance the dimensional accuracy in a wafer by developing in a positive resist developing unit using for a semiconductor manufacturing apparatus by bending the upper surface of a wafer chuck in a raised shape and then equalizing the developer distribution on the wafer at the rotating time. CONSTITUTION:In a positive resist developing unit used for a semiconductor manufacturing apparatus, the upper surface of a wafer chuck 302 for forming it is bent in a raised shape. Thus, the wafer 1 is attracted onto the chuck 32, the developer 304 is absorbed along the raised shape when scattering the developer 34 from a nozzle 303, and readily flowed from the center of the wafer 301 toward the outer periphery. Accordingly, the thickness of the developer 304 on the outer periphery is not thickened, but becomes uniform distributed state to eliminate the irregularity in the size of the resist pattern. |
