发明名称 JOINING METHOD
摘要 PURPOSE:To obtain a defectless joint part having high joint strength by specifying the length of a preliminary solder coating layer and heating only the other metallic pipe thereby performing soldering. CONSTITUTION:The joint end part of an Al pipe 1 and a Cu pipe 2 is dipped in a solder bath to form solder coating layers 5, 6. Ultrasonic oscillation is applied to the molten solder from an ultrasonic horn in this state. The dipping depth L of the pipe 1 and the pipe 2 into the solder bath is made to >=1.5 times the length A of the expanding part 1a of the pipe 1 in the axial direction thereof. The pipe 2 is coaxially fitted into the part 1a of the pipe 1 and the pipe 2 near the part 1a is heated by a gas burner 11 and at the same time, ultrasonic oscillation is applied thereto. The solder coating layer melts and the clearance formed in the part 1a is filled by the molten solder.
申请公布号 JPS60115365(A) 申请公布日期 1985.06.21
申请号 JP19830221393 申请日期 1983.11.26
申请人 TOSHIBA KK 发明人 MAEHARA YOUICHIROU
分类号 F16L13/08;B23K1/06;B23K1/18 主分类号 F16L13/08
代理机构 代理人
主权项
地址