发明名称 METHOD FOR ETCHING THIN METALLIC PLATE
摘要 PURPOSE:To enable the etching of a thin metallic plate having a larger thickness than a conventional one by forming a resist film having a large opening whose diameter is larger than the width of an opening for piercing a fine gap at an intermediate part of the opening in the longitudinal direction in a stage for forming a resist film. CONSTITUTION:A resist film 12 having a large opening 19 whose diameter D is larger than the width W of an opening 18 for piercing a fine gap at an intermediate part of the opening 18 in the longitudinal direction is formed on a ''Kovar'' plate 11 in a stage for forming a resist film. The plate 11 having the resist film 12 is immersed in an etching soln. to etch the exposed part of the plate 11 under the opening 18. At this time, the etching soln. is easily fed to the opening 18 through the large opening 19, so the rate of etching is increased.
申请公布号 JPS60114578(A) 申请公布日期 1985.06.21
申请号 JP19830222715 申请日期 1983.11.25
申请人 KANSAI NIPPON DENKI KK 发明人 FUJII KENZOU
分类号 C23F1/00;C23F1/02;H03H3/007;H03H9/13 主分类号 C23F1/00
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