| 摘要 |
<p>PURPOSE:To simplify the process of production and to reduce delicate work by using one or more coloring matter layers already formed on a substrate as the substitute of an exposure mask and exposing a photoresist film from the side on which the color layer is not formed on the transparent substrate. CONSTITUTION:A positive type photoresist layer 4 is formed on one or more coloring matter films formed on the substrate 1. After being dried, the resist layer is prebaked under a proper temperature condition. Subsequently, the resist film is exposed to ultraviolet ray, far ultraviolet rays, or the like from the side on which the resist film 4 is not formed on the transparent substrate 1. The resist film on the exposed part is selectively dissolved by using a developing solution to obtain a resist pattern 4' leaving the resist only on the upper part of the coloring matter layer. Then, the final coloring matter layer 6 is evaporated on the substrate 1. Finally, the resist pattern 4' is removed by the resist developing solution or the like, so that the unnecessary coloring matter layer is also removed together with the resist pattern.</p> |
