发明名称 MOUNTING METHOD OF INTEGRATED CIRCUIT ELEMENT
摘要 PURPOSE:To attain a thin structure and to enable easy replacement of LSI, by contact-bonding the end portion of a flexible printed board with an LSI chip mounted thereon and the terminal portion of a main printed board so as to obtain an electric connection. CONSTITUTION:An LSI chip 7 is mounted on a flexible printed board 8. The other end of a conductor member 8a forms a folded portion at the end 8c of the flexible printed board 8 and is contact-bonded to a terminal portion 10 provided on a main printed board 9 whereon other main electric circuit components are arranged. Then, said end of the conductor member is fixed by a presser bar 11 and connected electrically to the terminal portion 10. By loosening the presser bar 11, the LSI chip 7 can be removed together with the flexible printed board 8, and thus easy replacement by a flexible printed board fixed with an LSI chip to be substituted is enabled.
申请公布号 JPS60115249(A) 申请公布日期 1985.06.21
申请号 JP19830223662 申请日期 1983.11.28
申请人 MATSUSHITA DENKI SANGYO KK 发明人 HARADA MASAYUKI
分类号 H01L23/32;H01L23/498;H05K3/32;H05K3/36 主分类号 H01L23/32
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