TREATMENT OF SOLDER AFTER DIPPING INTO SOLDER

摘要

PURPOSE:To remove fused solder blocking the carrier hole of a semiconductor device by blowing heated air just after pulling up lead-out wires of the semiconductor device from fused solder. CONSTITUTION:A heater 12 is built in a pipe 11 of a solder shaping device. If air is blown into the pipe 11, heated air is blown out from a nozzle 13. A lead frame 1 and lead-out wires 2 are dipped in fused solder in a solder tank and blown by heated air from the obliquely upper direction just after being pulled out, and the fused solder 4 blocking a carrier hole 5 is removed by heat and air pressure. This allows troubles generated in a tie bar cut process and so forth to be extremely reduced.