| 摘要 |
<p>PURPOSE:To improve a yield in the case when a semiconductor chip is mounted on a ceramic base and sealing is made with a ceramic cap by soldering by a method wherein a metallization pattern on the cap side is formed in such a manner that it protrudes from the joint region with a vessel. CONSTITUTION:A semiconductor chip 12 is mounted on an alumina base 11 and connected electrically to a lead pin 14 by a metallization line 16 and a fine wire 15 of gold or aluminum. Then, a metallization pattern 18 for soldering formed on an alumina cap 13 is expanded beyond the joint region with the base 11, to the inside or lateral side of the base 11. A metallization pattern 17 for seldering on the base side 11 is preferably expanded as well. In sealing, surplus solder forced out from a joint portion under pressure sticks on the surface of the expanded portion of the metallization, not flowing onto the inside metallization 16 and not scattering over the fine wire 15 and the chip 12.</p> |
