| 摘要 |
PURPOSE:To enable to automatically dispose a peripheral buffer circuit for input and output in a master slice LSI in an IC in a structure, wherein pads for input and output have been arranged on the peripheral parts of a semiconductor chip provided with internal logic circuits, by a method wherein the peripheral buffer circuit for input and output is provided on the inner sides of the pads for input and output through wiring regions. CONSTITUTION:Plural internal logic circuits 3 are formed in a sheet of Si substrate 1 and numerous pads 2 for input and output are provided on the peripheral parts of the substrate 1. A peripheral buffer circuit 4 for input and output is formed on the inner sides of the pads 2. At this time, wiring regions 5 for connecting the pads 2 and the circuit 4 is readily provided in between the pads 2 and the circuit 4. According to such a method, in a master slice LSI such as a gate array, it becomes possible to automatize the layout of the peripheral buffer circuit 4. |
