| 摘要 |
PURPOSE:To increase the bonding strength, to reduce the deterioration of Q and further to decrease contour by forming a copper electrode after a silver electrode is formed to the inner circumference and the outer circumference of a dielectric of coaxial construction. CONSTITUTION:The silver electrode 6 (e.g., paste mixed with ''Dupont D-8205'' and Ag powder) is coated thinly to the inner circumference 2 and the outer circumference 3 of the dielectric 1 of coaxial construction and both end faces 4, 5 in a coaxial TEMlambda/4 resonator, surface treatment (for 5min in 10% of hydrochloric acid) is processed after baking (for 10min at 800 deg.C), chemical plating is performed so as to form 15-25mum of the thickness 7 of electrode. Then one side face 4 is removed. |
