| 摘要 |
PURPOSE:To improve the assembling workability by means of eliminating the dispersion of lead length for augmenting the performance of the titled device by a method wherein a transistor chip and a semiconductor condenser installed on a device substrate are lead-bonded to dispose insulating frame bodies in upright between the elements protruding beyond them for wiring the bonding leads over the elements. CONSTITUTION:A transistor chip 4 and a semiconductor condenser 5 etc. are installed on a device substrate 1 while electrode wirings provided thereon are connected to external terminal sheets 2 and 3 formed on both ends respectively using bonding leads 6-9. In such a constitution, ceramics made insulating frame bodies 11 are disposed in upright between the terminal chip 4, the condenser 5 and the external terminal sheet 3 protruding beyond them. Through these procedures, the leads 6, 8, 9 out of the leads 6-9 are connected over the frame bodies 11 while the lead 7 is connected directly to the frame bodies 11 and the lead 6 is directly connected to a metallic electrode 10 common to right and left side. |
