| 摘要 |
A multilayer dielectric structure, e.g. for use as a substrate for an electronic circuit, is formed by electrodeposition of a ceramic material from a liquid medium. The ceramic, in the form of a powder, is coated with a resin whereby the powder is dispersed in the liquid. The ceramic and resin are co-deposited, the resin being burned off during the subsequent firing process to form the ceramic dielectric. The ceramic laser 11 may be deposited onto a nickel foil substrate 12 which has been treated with a release agent. After removal of the foil, the ceramic sheet is printed with a conductive ink to provide conductive electrodes 22, eg of nickel or nickel alloy, heated at 300 to 350 DEG to remove organic material, then at 900 to 1500 DEG C to fire the ceramic. <IMAGE> |
