| 发明名称 |
Rapid solidified soldering filler metals. |
| 摘要 |
<p>A rapidly solidified, homogeneous soldering foil has a thickness ranging from 12 to 200 micrometers. The foil is at least 2 millimeters wide, of substantially uniform cross section along its length and has a composition consisting essentially of at least two elements selected from the group consisting of Au, Ag, Pb, Bi, Si, Sn, Sb, In and Ge.</p> |
| 申请公布号 |
EP0144998(A2) |
申请公布日期 |
1985.06.19 |
| 申请号 |
EP19840114990 |
申请日期 |
1984.12.08 |
| 申请人 |
ALLIED CORPORATION |
发明人 |
BEDELL, JOHN ROBERT;HEMMAT, NAIM;RABINKIN, ANATOL;BOSE, DEBASIS;DATTA, AMITAVA;DECRISTOFARO, NICHOLAS JOHN |
| 分类号 |
B23K35/02;B23K35/14;B23K35/26;B23K35/30;H05K3/34;(IPC1-7):B23K35/14 |
主分类号 |
B23K35/02 |
| 代理机构 |
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代理人 |
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| 主权项 |
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| 地址 |
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