| 摘要 |
The degree of thixotropic character exhibited by curable compositions comprising specified epoxide reactants, organosilicon reactants and fillers can be varied by varying the weight ratio of epoxide reactant to organosilicon reactant between values represented by r1 and r2 wherein said values are within the range of from 1:1 to 8:1. The compositions are particularly useful as extrudable coatings for solid state electronic devices. |
