发明名称 |
Adhesive resin composition. |
摘要 |
<p>An adhesive resin composition comprises 40 to 80 parts by weight of (A) a thermoplastic copolyester resin prepared from (1) a dicarboxylic acid component comprising from 40 to 100 mol% of terephthalic acid and from 0 to 60 mol% of another aromatic dicarboxylic acid (e.g. isophthalic) and (2) a low molecular weight glycol component comprising 40 to 100 mol% of 1,4-butanediol and 0 to 60 mol% of diethylene glycol or 1,6-hexanediol, and optionally 0 to 10 mol% of the total carboxylic acid of polytetramethylene glycol having a molecular weight of from 600 to 6,000, which has a melting point of 90 to 160°C and a reduced viscosity of at least 0.5; and (B) an ethylene copolymer having at least one epoxy, carboxylic acid or dicarboxylic anhydride functional group; and optionally (C) a thermoplastic resin other than the resin (A), and further optionally (D) a polyfunctional epoxy compound.</p><p>The composition contains by wt, 40 to 80% of (A) and 60 to 20% of (B) + (C) and up to 20 parts of (D) per 100 of (A), (B) and (C).</p><p>This composition exhibits excellent adhesion to synthetic resins such as polyvinyl chloride, polyesters and polyolefins and also to metals such as aluminium and has excellent adhesive durability against moisture.</p> |
申请公布号 |
EP0145391(A2) |
申请公布日期 |
1985.06.19 |
申请号 |
EP19840308158 |
申请日期 |
1984.11.23 |
申请人 |
SUMITOMO CHEMICAL COMPANY, LIMITED;TOYOBO CO., LTD. |
发明人 |
OHMAE, TADAYUKI;NAGAI, HIROSHI;OKADA, MITSUYUKI;MIZUMURA, YUTAKA |
分类号 |
C08G63/672;C09J167/02;(IPC1-7):C09J3/16;C09J3/14 |
主分类号 |
C08G63/672 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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