| 摘要 |
PURPOSE:To prevent the generation of soldering failure at the time of mounting lead pins by a method wherein a difficultly processed solder of Au-Sn alloy, etc. is previously brazed to the lead pins or a lead frame. CONSTITUTION:The lead pins 3 are inserted into many holes 2 of a carbon jig 1, and Au-Sn 20% alloy balls 4 are placed thereon one by one and then set-up; thereafter, welded by heating at 350 deg.C in a furnace with hydrogen atmosphere. The lead pins 3' with Au-Sn 20% alloy solder 4' obtained in such a manner are inserted into 1,000 holes 7 of the carbon jig 6 set-up on an Ni plate 5 respectively, with the solder 5' lower side, and this solder 4' is set up in contact with the Ni plate 5, thus brazing the lead pins 400 deg.C in a furnace with nitrogen atmosphere. Thus, the generation of the soldering defects in lead pin mounting can be prevented. |
