| 发明名称 |
Method for forming a film of a polyimide dielectric material on an electronic component and the resulting component. |
| 摘要 |
<p>Thin dielectric films are formed on an electronic component by in situ curing a polymerizable oligomer which is end capped with vinyl and/or acetylenic end groups. An electronic component comprising the cured product is also disclosed.</p> |
| 申请公布号 |
EP0144661(A2) |
申请公布日期 |
1985.06.19 |
| 申请号 |
EP19840112629 |
申请日期 |
1984.10.19 |
| 申请人 |
IBM DEUTSCHLAND GMBH |
发明人 |
ARAPS, CONSTANCE JOAN;KANDETZKE, STEVEN MICHAEL;TAKACS, MARK ANTHONY |
| 分类号 |
H01L23/29;C08F290/00;C08F299/02;C08G73/10;H01L21/312;H01L23/31;(IPC1-7):H01L21/312 |
主分类号 |
H01L23/29 |
| 代理机构 |
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代理人 |
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| 主权项 |
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| 地址 |
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