发明名称 PHOTOSENSITIVE SOLDER RESIST
摘要 PURPOSE:To obtain a photosensitive solder resist superior in storage stability and capable of forming a permanent protective film by irradiation of actinic rays, by mixing a linear polymer having double bonds on the side chains, a specified photopolymerizable unsatd. compd., and a sensitizer. CONSTITUTION:An objective photosensitive solder resist is obtained by mixing (A) a linear polymer having double bonds on the side chains, such as a reaction product between a glycidyl acrylate-acrylate copolymer and acrylic acid, (B) a photopolymerizable unsatd. compd. having at least >=2 terminal ethylenic groups on the average, such as triethylene glycol acrylate or propylene glycol meth- acrylate, (C) and a sensitizer, such as benzophenone, for initiating polymn. of the component (A) with the component (B) by irradiating actinic rays to form a high cross-linking structure.
申请公布号 JPS60112035(A) 申请公布日期 1985.06.18
申请号 JP19830220062 申请日期 1983.11.22
申请人 SEKISUI KAGAKU KOGYO KK 发明人 ARAKI YASUHIKO;YANAGISAWA KUNIO;SHIYOUHI HAJIME
分类号 C08F2/00;C08F2/48;C08F2/50;C08F290/00;C08F299/00;G03F7/004;G03F7/033;G03F7/038 主分类号 C08F2/00
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