| 摘要 |
PURPOSE:To form a titled solder layer having a desired uniform thickness in a desired part by detecting the heating up of the string solder in contact with the metallized pattern of a circuit board to a prescribed temp. and starting the movement of the circuit board or the wire solder. CONSTITUTION:A circuit board 1 consisting of a composite material plate of ceramics, etc. is heated by a heat transfer plate disposed in the prescribed position of a base plate 6 of a soldering device 8 so as to be maintained in the state adequate for soldering of a solder layer 2. The melt and consumption of string solder 5 are detected by a rotor 9 mounted to a solder supply nozzle 4 and the solder 5 is supplied by the rotor 9. The supply of the solder 5 and the movement of the plate 6 are accomplished by NC control, etc. More specifically, the nozzle 4 is pressed to the metallized pattern 3 of the board 1 and the melt and consumption of the solder 5 are sensed by the rotor 9, the signal thereof is fed to a control device 7. The nozzle 4 is then controlled so as to move along the pattern of the board 1 by motors 10 and 11 which drive the plate 6 in transverse and longitudinal directions respectively, thereby forming the solder layer 2 to the prescribed thickness. |
