发明名称 METAL MOLD FOR RESIN SEALING OF SEMICONDUCTOR DEVICE
摘要 PURPOSE:To enable to smoothly release the titled metal mold from an air pressure introducing passage constituting a lead frame by a method wherein, when the metal mold is released from the air pressure introducing passage provided by providing apertures on the matching surface of the lower and top forces of the metal mold, compressed air is introduced in the air pressure introducing passage. CONSTITUTION:A top force 21 constitutes a resin sealed metal mold along with a bottom force, which hasn't been shown in the diagram. A cavity 22 to be used for molding a resin molding layer 1 is provided on the matching surface of the top force 21 and the bottom force. An air pressure introducing passage 23 is provided in the interior of the top force 21 and the apertures of the air pressure introducing passage 23 are provided on positions, where a lead frame outer frame 3 at the matching surface is disposed. A resin sealing of the lead frame performed a die-bonding and a wire- bonding is performed using this resin sealing metal mold. After that, when the lead frame is released from the top force 21, compressed air is introduced in the air pressure introducing passage 23, thereby enabling to smoothly release the lead frame from the top force 21. Accordingly, hair crackings to generate in the resin molding layer 1 can be remarkably suppressed. As a result, the yield can be improved.
申请公布号 JPS60111432(A) 申请公布日期 1985.06.17
申请号 JP19830219701 申请日期 1983.11.22
申请人 TOSHIBA KK 发明人 KAWASHIMA TAKASHI;HORI MORIAKI
分类号 B29C39/10;B29C33/46;B29C39/36;B29L31/34;H01L21/56 主分类号 B29C39/10
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