发明名称 PRESSURE CONTACT TYPE SEMICONDUCTOR DEVICE
摘要 PURPOSE:To sufficiently enhance internal airtightness and to improve performance characteristics by a method wherein synthetic resin material is fixed secure to the vicinity of the interface between a package composed of synthetic resin material and a pair of external electrodes composed of metal plates. CONSTITUTION:Synthetic resin material 12 composed of a silicone varnish and is different from the material constituting a package 5 adheres to the vicinity of the interfaces between the package 5 and metal members 6 and between the package 5 and a metal plate 1. With the synthetic resin material 12 adhering to the vicinity of interfaces, the stress, present between the metal members 6, metal plate 1, and the package 5, is mostly absorbed by the synthetic resin material 12. With the device designed as such, cracks that used to grow worse in the package 5 can now be stopped and a sufficiently high internal airtightness can be attained in spite of the use of a synthetic resin in the construction of the package 5.
申请公布号 JPS60111444(A) 申请公布日期 1985.06.17
申请号 JP19830219704 申请日期 1983.11.22
申请人 TOSHIBA KK 发明人 NUMATA SHIZUYA
分类号 H01L23/04;H01L23/051;H01L23/48 主分类号 H01L23/04
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