Semiconductor mounting package for optical devices - has central island of metal attached by metal bridges and preformed glass insert

摘要

The package is based on the standard metal 'top-hat' cap used in many transistor and integrated circuit packages. The cap has a flange (2), cylindrical body and upper surface (3). The upper surface of the present package is pierced (5,6) e.g. by a press, to leave a central island of metal (4) attached to the rest of the cap by thin metal bridges. A preformed glass insert containing connecting wires (9 to 12) is inserted in the cap. The pins may be spot-welded (11) into the cap or (9) to the island or left to protrude (10,12) through the holes. The glass is then melted to seal the inside of the cap, and the bridges are melted by passing current through them. The semiconductor device is then mounted in the island and connected to the pins.