| 摘要 |
PURPOSE:To simplify the structure of a thermal recording head as well as raise the radiation efficiency of heat by providing a heat pipe structure having an evaporation region and a condensation region for the supporter of a thermal recording head having a heating element on its supporter. CONSTITUTION:In a head 20, the base 1 as a supporter has a cavity 21 inside, and a netted wick 22 is provided to the wall face of the cavity 21. The wick 22 is impregnated with a liquid (e.g., water) for heat exchange. In the cavity 21, an evaporation region A is provided below the heating element 2, and a condensation region B is provided at a far position of the side of IC chip 4. During the operation, water in the wick 22 in the evaporation region A is evaporated by heat generated in the heating element 2. The heat is absorbed by water vapor, and the water vapor flows to the condensation region B where heat is released from the water vapor and the water vapor is liquefied. The heat of the heating element 2 can thus be effectively discharged to the outside by said heat pipe structure. |
