发明名称 HYBRID INTEGRATED CIRCUIT
摘要 PURPOSE:To reduce the creep of a sealing substance on a wall surface by forming a step on the inner wall of a vessel. CONSTITUTION:A step 7 is formed on the inner wall of a vessel 4 which contains electric parts mounted on a substrate. Thus, the creep of a sealing substance 5 of liquid is controlled by a step 7, and the thickness of a substance 6 does not become extremely thin. The thickness of the substance 6 becomes uniform, thereby providing excellent impact resistance and environmental resistance.
申请公布号 JPS60110144(A) 申请公布日期 1985.06.15
申请号 JP19830218212 申请日期 1983.11.18
申请人 MITSUBISHI DENKI KK 发明人 TAKADONO HIDEAKI
分类号 H01L23/28;H01L21/50 主分类号 H01L23/28
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