| 摘要 |
PURPOSE:To prevent the generation of adverse effects due to quenching after soldering by providing a heat dissipating member abutting against the top of a matter to be soldered. CONSTITUTION:When semiconductor devices 13 are transferred and mounted through respective window holes 6 to holding members 8 in a casting manner with the heat dissipating member 10 opened, the devices are supported over bottom holding members 8a, and outer leads 20 project under the members 8a. After a desired number of the devices are held to the members 8, the member 10 is pivoted downward, and each of the devices is sandwiched between the member 8. When in this state engagement parts 4 are engaged to guides 22 and the jig 1 is passed through a flow dip part 21, the surface of each other lead is coated with a solder layer. At this time, the devices are heated to high temperatures, but pre-cooled more rapidly than spontaneous cooling and gradually because of the abutment of the member 10, and come to a low temperature of approximately the room temperature when carried to the process of washing. |
