发明名称 Method and device for automatically laying additional wires on printed-circuit boards
摘要 A special gripping tool which is guided by an industrial robot has been developed for laying additional wires, including the handling for preparation of the wires (cutting to length, insulation stripping, winding eyes, soldering). It consists, for example, of two tongs 1, which can be driven independently of one another and, in the clamping region, form a clamping prism 2 for clamping a wire 3. The tongs levers are held together by spring force 7 and can be opened completely or partially by means of pneumatic cylinders 4 which can be driven. In the direct access region of the gripping tool, functional assemblies 9-11, which are flanged directly on the industrial robot base frame, are provided for wire preparation. <IMAGE>
申请公布号 DE3344651(A1) 申请公布日期 1985.06.13
申请号 DE19833344651 申请日期 1983.12.09
申请人 SIEMENS AG 发明人 EDINGER,EGON;KLOKE,WOLFGANG
分类号 H05K13/06;(IPC1-7):H05K13/06 主分类号 H05K13/06
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