| 摘要 |
PURPOSE:To adhere tentatively and securely electronic parts by means of undried paste to a wiring board and to improve reliability of mounting by pressing the electrodes of the electronic parts to the paste coated on the board and applying mechanical oscillation thereto to break the dry film of the paste surface. CONSTITUTION:Thin film conductors of a prescribed pattern are printed on the main surface of a circuit board 1 consisting of ceramics and are calcined. Solder paste is coated by metal or screen printing in the position of the board 1 where flat package type electronic parts 2 are to be mounted. The board 1 is then placed on a table 3 and the parts 2 on a stage 4 are sucked by a vacuum chuck 5. The parts 2 are then brought into contact with the part of the board 1 on the table 3 where the paste is coated by a grip 6. The leads 7 of the parts 2 are pressed to the board 1 by the grip 6 and at the same time an oscillating source contained in the table 3 is actuated to oscillate mechanically the table 3. The dry part of the paste surface is then broken down and the parts 2 are tentatively fixed to the board 1 by the high tack of the internal undried solder paste, by which the reflow soldering without positional deviation is made possible |
