发明名称 METHOD FOR FILLING AND PACKAGING
摘要 PURPOSE:To make it possible to improve the hot tack property in high-temperature sealing and increase the speed of continuous filling and packaging, by using a composition consisting of a specific ethylene based polymer and a straight chain low-density ethylenic copolymer in a heat sealing site of a packaging material. CONSTITUTION:A composition prepared by incorporating (A) 60-97wt% one or more selected from (i) high-pressure produced low-density polyethylene (having <=0.93g/cm<3> density), (ii) ethylene-vinyl acetate copolymer, (iii) ethylene-ethyl acrylate copolymer and (iv) terpolymer of ethylene, vinyl acetate and ethyl acrylate (<=30wt% comonomer other than ethylene) with (B) 40-3wt% straight chain low-density ethylenic copolymer of ethylene and an alpha-olefin (containing 5- 30wt% 3-8C alpha-olefin, and having 0.91-0.935g/cm<3> density) for use in at least a heat-sealing site of a packaging material. The respective components preferably have 0.01-100g/10min MFR (melt flow rate).
申请公布号 JPS60108446(A) 申请公布日期 1985.06.13
申请号 JP19830217476 申请日期 1983.11.18
申请人 MITSUBISHI YUKA KK 发明人 ISHIZAKI YOSHIHIRO;HASHIMOTO YOSHINORI;YAMASHITA TAKASHI
分类号 C08L23/04;B65B9/02;B65D65/38;C08L7/00;C08L21/00;C08L23/00;C08L23/08;C08L31/04;C08L33/00;C08L33/02;C08L101/00 主分类号 C08L23/04
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