发明名称 MANUFACTURE OF OSCILLATING ELEMENT
摘要 PURPOSE:To reinforce the adhesion between a chip and terminal electrodes and reduce spurious phenomena by beveling facing terminals of a piezoelectric chip where terminal electrodes are formed, and then forming facing electrodes on main facing surfaces of the chip and said terminal electrodes. CONSTITUTION:An oscillating element 21 is formed by forming the facing electrodes 23 on the main facing surfaces of the chip 22 which is rectangular in plane view respectively and then forming terminal electrodes 24 for external connections at the lengthwise terminal parts. Said terminal parts are beveled piror to the formation of the electrodes 23 to form slanting surfaces 22a. Then, the terminal electrodes of the oscillating element are beveled and formed at the terminal parts of the oscillation chip, so the adhesive strength between the chip and terminal electrodes is increased enough to withstand a thermal shock, and reflected elastic waves are refracted on the chip end surfaces, thereby reducing spurious radiation.
申请公布号 JPS60107909(A) 申请公布日期 1985.06.13
申请号 JP19830215203 申请日期 1983.11.16
申请人 FUJITSU KK 发明人 SASAKI IWAO
分类号 H03H3/02;H03H9/05;(IPC1-7):H03H3/02 主分类号 H03H3/02
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