发明名称 EPOXY RESIN COMPOSITION
摘要 PURPOSE:To obtain the titled highly curable composition with long pot life near room temperature, by incorporating specific curing promotor in a resin composition comprising epoxy resin and acid anhydride. CONSTITUTION:The objective composition can be obtained by incorporating a resin composition comprising (A) epoxy resin and (B) as curing agent, an acid anhydride (e.g. maleic anhydride) with, as curing promotor, (C) pref. 0.5- 15 pts.wt. based on 100pts.wt. of the component (A), of a product derived from the reaction, at 20-200 deg.C, between (i) metal acetylacetonate (e.g. chromium acetylacetonate), (ii) acid anhydride and (iii) mono-or polyethylene glycol or mono-or polypropylene glycol monoalkyl ether in such a weight ratio (i)/(ii)/(iii) as to be pref. 1/1-20:1-20.
申请公布号 JPS60108418(A) 申请公布日期 1985.06.13
申请号 JP19830215091 申请日期 1983.11.17
申请人 YASUKAWA DENKI SEISAKUSHO KK 发明人 TANAKA YOSHIYUKI;OOMORI FUMIHIRO
分类号 C08G59/00;C08G59/42;C08G59/68;C08L63/00;H01B3/40 主分类号 C08G59/00
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