| 摘要 |
PURPOSE:To facilitate the temperature compensation of a microwave integrated circuit by coating the upper section of a microstrip line on the output side with a wave absorber and inserting a heat-shrinkable dielectric between a dielectric substrate and the wave absorber. CONSTITUTION:Microstrip lines 2, the microwave input sides 5 and output sides 6 thereof are each exposed, are arranged oppositely on a dielectric substrate 1, FET elements 3 for amplifying microwaves are connected at these intersecting points, and the lines 2 are supplied with bias voltage by patterns 10a and 10b for chokes connected to the lines 2. Chip capacitors 4 cutting DCs are fitted on to each line 2, and used as microwave integrated circuits. In the constitution, a wave absorber 11 is wired on the line 2 on the output side while being straddled over the line 2 on the output side, and both ends of the wave absorber are fixed to the substrate 1 through extensible dielectrics 12. Accordingly, the dielectrics 12 are contracted at a low temperature and expanded at a high temperature and clearances among the dielectrics 12 and the line 2 are changed, and the output change of the FET element 3 due to a temperature change is compensated. |
