发明名称 ASSEMBLY TYPE SUPPORTER
摘要 PURPOSE:To transfer wafers easily into a vertical type diffusion furnace while being kept under a horizontal state by constituting a jig taking in and out the semiconductor wafers into the furnace by upper and lower end plates and a plurality of rods connecting these end plates, previously notching plural steps of holding grooves, into which the end edges of the wafers are inserted, to the inner walls of the rods and making a supporter manufactured in this manner face to the opening end of the diffusion furnace. CONSTITUTION:Discoid upper and lower end plates 2b and 2a are combined by four rods 4a-4d having square sections, and one guide rod 6 is fitted besides the rods. Through-holes 10 and 20 into which four rods 4a-4d are inserted are each bored to these end plates 2b and 2a, and these rods are clamped by tapered wedges 36, 38, 40, 42, etc. These rods 4a-4d are united only with the half-fringe sections of the end plates 2b and 2a, and the fronts of the end plates are brought to an open state. In the constitution, a plural step of holding grooves 30 are notched previously to each inner wall of the rods 4a-4d, and wafers 35 are fed to the holding grooves, and transferred into a diffusion furnace in succession as required.
申请公布号 JPS60107843(A) 申请公布日期 1985.06.13
申请号 JP19830214209 申请日期 1983.11.16
申请人 TEKUNISUKO:KK 发明人 SEKIYA SHINJI
分类号 H01L21/683;H01L21/22;H01L21/67;H01L21/673;H01L21/68 主分类号 H01L21/683
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