发明名称 PREPARATION OF PHENOLIC RESIN MOLDING
摘要 PURPOSE:To obtain the titled non-corrosive moldings by incorporating an acid curing agent and a powdered acid acceptor coated with a water-soluble polymer into a hydrous uncured resol type phenolformaldehyde resin liquid, and heating it for curing. CONSTITUTION:100pts.vol. Powdered acid acceptor (e.g. metallic zinc) having particle diameters of 0.005-1,000mu is coated with 5-100pts.vol. water-soluble polymer (e.g. PVA). Then, 5-40pts.wt. curing agent (e.g. phenolsulfonic acid) and 0.3-20pts.vol. aforementioned powdered acid acceptor per 100pts.vol. uncured resin are incorporated into 100pts.wt. hydrous uncured resol type phenol-formaldehyde resin liquid, and the composition is heated at 25-200 deg.C for curing.
申请公布号 JPS60106851(A) 申请公布日期 1985.06.12
申请号 JP19830212825 申请日期 1983.11.12
申请人 SEKISUI KASEIHIN KOGYO KK 发明人 KOBAYASHI YOSHIKAZU;TANAKA SHIGETOSHI
分类号 C08K9/04;C08L61/00;C08L61/04;C08L61/06 主分类号 C08K9/04
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